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Lattice semiconductor Corporation Avant FPGA | Demoboard Avant-G Versa Board
Prototyping Board featuring Mid-range FPGA with 12.5G SERDES
Details
| Topologie | FPGA |
| IC-Revision | 1.2 |
Beschreibung
The Lattice Semiconductor Avant-G Versa Board allows designers to design and develop solutions with the most advanced bitstream security features such as Encryption (AES256-GCM), Authentication (ECC512, RSA4096), SHA3 for Post Quantum Crypto, PUF, tamper monitor, TRNG and Side-channel resistance. The Avant-G Versa Board supports several industry standards, providing engineers with a convenient platform for rapid prototyping and testing of their specific designs.The board features the Avant-G 500 LC FPGA in a 1156-ball fcBGA package (LAV-AT-G70-3LFG1156I) with 12.5G SERDES, on-board LPDDR4, PCIe and majority of I/O bonded out to FMC+, PMOD, SMA and other connectors available for user-defined applications that allows designers to investigate and experiment with the features of the Avant family.
Eigenschaften
Supports PCIeSupports SPI for dual boot and Raspberry Pi 4 interfaceProvides 1x 40GE port connected to a QSFP28 module cagProvides 2x 10GE ports connected to SFP28 module cagesSupports USB 3.1 Gen1 interface for high-speed data and video through Cypress USB 3.1 bridge
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | f | Stabilität (ppm) | Betriebstemperatur | Ausgangsschaltnetz | VSupply (V) | C | Tol. C | VR (V (DC)) | Bauform | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150040GS73240 | SPEC | 6 Dateien | WL-SMCC SMT Mono-color Chip LED Compact | 525 | Grün | 515 | 800 | 3.2 | InGaN | 120 | – | – | -40 °C up to +85 °C | – | – | – | – | – | 0402 | – | – | – | 1 | 0.5 | – | Tape and Reel | – | – | – | – | – | 0.4 | – | ||
 | 150040RS73220 | SPEC | 6 Dateien | WL-SMCC SMT Mono-color Chip LED Compact | 624 | Rot | 632 | 110 | 2 | AlInGaP | 120 | – | – | -40 °C up to +85 °C | – | – | – | – | – | 0402 | – | – | – | 1 | 0.5 | – | – | – | – | – | – | – | 0.25 | – | ||
 | 74279221100 | SPEC | 8 Dateien | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | – | – | – | 1206 | – | – | – | 3.2 | 1.6 | 0.5 | – | 10 | 41 | 2178 MHz | 10500 | 28 | 1.1 | High Current | ||
 | 885012206042 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | 22 nF | ±10% | 16 | 0603 | 3.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | 0.8 | – | ||
| 885012206087 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | 4.7 nF | ±10% | 50 | 0603 | 2.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | 0.8 | – | ||
 | 830208217009 | SPEC | – | 5 Dateien | WE-SPXO Quarzoszillator | – | – | – | – | – | – | – | 19.2 MHz | 25 | -20 °C up to +70 °C | CMOS | 1.8 | – | – | – | IQXO-542 | – | – | – | 2 | 1.6 | – | – | – | – | – | – | – | 0.7 | – | |
| 830208222201 | SPEC | – | 5 Dateien | WE-SPXO Quarzoszillator | – | – | – | – | – | – | – | 19.2 MHz | 25 | -20 °C up to +70 °C | HCMOS | 1.8 | – | – | – | IQXO-794 | – | – | – | 2.5 | 2 | – | – | – | – | – | – | – | 1 | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150040GS73240 | SPEC | |
| 150040RS73220 | SPEC | |
| 74279221100 | SPEC | |
| 885012206042 | SPEC | |
| 885012206087 | SPEC | |
| 830208217009 | SPEC | – |
| 830208222201 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | f | Stabilität (ppm) | Betriebstemperatur | Ausgangsschaltnetz | VSupply (V) | C | Tol. C | VR (V (DC)) | Bauform | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Typ | Muster |
|---|