Topologie | FPGA |
IC-Revision | Plus |
Easy-to-use, low cost breakout board for evaluation and development – Enables the broadest capability for development and uses the 36-ball WLCSP highest I/O package, high-density silicon iCE5LP4K.Rapid prototyping of user functions – Each I/O is made available via a header to facilitate rapid prototyping of user functions, and the board combines an RGB LED, a high current torch LED and an infrared LED for easy evaluation and development of LED functions.Effortless connectivity and simple programming – the board is powered and programmed via a simple USB mini cable, and comes preloaded with RGB LED demonstration code and a software GUI. Diamond programmer software can be used to reprogram the on-board SPI Flash with your customized code. The iCEcube2 software can be used to develop your own design. Both Diamond Programmer and iCEcube2 are available for free download.
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![]() | 61001021121 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird sich in Kürze das Datenblatt des ausgewählten Produktes ändern. Anbei finden Sie das neue Datenblatt, sowie das noch gültige Datenblatt. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | – |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV typ. (mcd) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF typ. (V) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Anwendung | Interface typ | Montageart | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins (pcs) | Reihen | H (mm) | Gender | IR (mA) | Verpackung | Muster |
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