IC-Hersteller NXP
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (172)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (929)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (110)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Battery Management System |
| Eingangsspannung | 6-26 V |
| Ausgang 1 | 26 V / 90 A |
| IC-Revision | A |
Beschreibung
The 33772 is a SMARTMOS lithium-ion battery cell controller IC designed for automotive applications, such as hybrid electric (HEV) and electric vehicles (EV) along with industrial applications, such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems. The device performs ADC conversions of the differential cell voltages and current, as well as battery coulomb counting and battery temperature measurements. The information is digitally transmitted through the Serial Peripheral Interface (SPI) or Transformer Isolation (TPL) to a microcontroller for processing.
Eigenschaften
- 5.0 V ≤ VPWR ≤ 30 V operation, 40 V transient
- 3 to 6 cells management
- 0.8 mV total cell voltage measurement error
- Isolated 2.0 Mbps differential communication or 4.0 Mbps SPI
- Addressable on initialization
- Synchronized cell voltage/current measurement with coulomb count
- Total stack voltage measurement
- Seven GPIO/temperature sensor inputs
- 5.0 V reference supply output with 5 mA capability
- Automatic over/undervoltage and temperature detection routable to fault pin
- Integrated sleep mode over/undervoltage and temperature monitoring
- Onboard 300 mA passive cell balancing with diagnostics
- Hot plug capable
- Detection of internal and external faults, as open lines, shorts, and leakages
- Designed to support ISO 26262 up to ASIL D safety system
- Fully compatible with the MC33771 for a maximum of 14 cells
- Qualified in compliance with AEC-Q100
Typische Anwendungen
- Uninterruptible Power Supply (UPS)
- Automotive: 12 V to high-voltage battery packs, E-bikes, e-scooters, Energy Storage Systems (ESS), Battery junction box
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Farbe | λPeak G typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | RDC max. (mΩ) | fres (MHz) | Montageart | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 885012005057 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 22 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 840 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205031 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205035 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 47 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205050 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205061 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 1 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205063 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 2.2 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205065 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 4.7 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205067 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
 | 62201021121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 1.27 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 500 MΩ | – | 6.35 | – | – | – | – | – | – | THT | 10 | Dual | – | Pin Header | Gerade | 1 | Karton | |
 | 74406043101 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQFS SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 4828 | -40 °C up to +125 °C | – | – | – | – | 4.8 | 4.8 | – | 100 | 0.37 | 600 | 11 | SMT | – | – | 2.8 | – | – | 0.62 | – | ||
 | 155124M173200 | SPEC | – | 29 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SFSW SMT Full-color Side View Waterclear | Rot & Grün & Blau | 515 | 465 | 523 | 622 | 140 | 850 | 450 | 3 | 2.8 | 2 | AlInGaP + InGaN | 120 | – | – | – | 1204 | -40 °C up to +85 °C | – | – | – | – | 3.2 | 1.5 | – | – | – | – | – | SMT | – | – | 1 | – | – | – | Tape and Reel |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Farbe | λPeak G typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | RDC max. (mΩ) | fres (MHz) | Montageart | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|