IC manufacturers NXP

IC manufacturers (103)

NXP MC33772B | Demoboard RDDRONE-BMS772

Smart Battery Management for Mobile Robotics

Overview

TopologyBattery Management System
Input voltage6-26 V
Output 126 V / 90 A
IC revisionA

Description

The 33772 is a SMARTMOS lithium-ion battery cell controller IC designed for automotive applications, such as hybrid electric (HEV) and electric vehicles (EV) along with industrial applications, such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems. The device performs ADC conversions of the differential cell voltages and current, as well as battery coulomb counting and battery temperature measurements. The information is digitally transmitted through the Serial Peripheral Interface (SPI) or Transformer Isolation (TPL) to a microcontroller for processing.

Features

  • 5.0 V ≤ VPWR ≤ 30 V operation, 40 V transient
  • 3 to 6 cells management
  • 0.8 mV total cell voltage measurement error
  • Isolated 2.0 Mbps differential communication or 4.0 Mbps SPI
  • Addressable on initialization
  • Synchronized cell voltage/current measurement with coulomb count
  • Total stack voltage measurement
  • Seven GPIO/temperature sensor inputs
  • 5.0 V reference supply output with 5 mA capability
  • Automatic over/undervoltage and temperature detection routable to fault pin
  • Integrated sleep mode over/undervoltage and temperature monitoring
  • Onboard 300 mA passive cell balancing with diagnostics
  • Hot plug capable
  • Detection of internal and external faults, as open lines, shorts, and leakages
  • Designed to support ISO 26262 up to ASIL D safety system
  • Fully compatible with the MC33771 for a maximum of 14 cells
  • Qualified in compliance with AEC-Q100

Typical applications

  • Automotive: 12 V to high-voltage battery packs, E-bikes, e-scooters, Energy Storage Systems (ESS), Battery junction box
  • Uninterruptible Power Supply (UPS)

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Emitting Color
λPeak B typ.(nm)
λPeak G typ.(nm)
λPeak R typ.(nm)
λDom B typ.(nm)
λDom G typ.(nm)
λDom R typ.(nm)
IV B typ.(mcd)
IV G typ.(mcd)
IV R typ.(mcd)
VF B typ.(V)
VF G typ.(V)
VF R typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IR(A)
ISAT(A)
RDC max.(mΩ)
fres(MHz)
Mount
Pins
Type
Working Voltage(V (AC))
Samples
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor840 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WR-PHD Pin Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-PHD Pin Header
Operating Temperature -40 °C up to +105 °C
Insulation Resistance500 MΩ
Length6.35 mm
PackagingBox 
Rated Current1 A
MountTHT 
Pins10 
TypeStraight 
Working Voltage100 V (AC)
WE-LQFS SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4828 
Operating Temperature -40 °C up to +125 °C
Length4.8 mm
Width4.8 mm
Height2.8 mm
Inductance100 µH
Rated Current0.62 A
Saturation Current0.37 A
DC Resistance600 mΩ
Self Resonant Frequency11 MHz
MountSMT 
WL-SFSW SMT Full-color Side View Waterclear, Red & Green & Blue, 460 nm
Simu­lation
Downloads30 files
Status Activei| Production is active. Expected lifetime: >10 years.
Emitting ColorRed & Green & Blue 
Peak Wavelength (Blue) [typ.]460 nm
Peak Wavelength (Green) [typ.]515 nm
Peak Wavelength (Red) [typ.]632 nm
Dominant Wavelength (Blue) [typ.]465 nm
Dominant Wavelength (Green) [typ.]523 nm
Dominant Wavelength (Red) [typ.]622 nm
Luminous Intensity (Blue) [typ.]140 mcd
Luminous Intensity (Green) [typ.]850 mcd
Luminous Intensity (Red) [typ.]450 mcd
Forward Voltage (Blue) [typ.]3 V
Forward Voltage (Green) [typ.]2.8 V
Forward Voltage (Red) [typ.]2 V
Chip TechnologyAlInGaP + InGaN 
Viewing Angle Phi 0° [typ.]120 °
Size1204 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.5 mm
Height1 mm
PackagingTape and Reel 
MountSMT