Topologie | Sonstige Topologie |
Eingangsspannung | 380-400 V |
Ausgang 1 | 800 V / 12.5 A |
IC-Revision | E3 |
This reference design provides an overview on how to implement a three-level, three-phase, SiC-based AC/DC converter with bi-directional functionality. A high switching frequency of 50 kHz reduces the size of magnetics for the filter design and as a result a higher power density. SiC MOSFETs with switching loss enable higher DC bus voltages of up to 800V and lower switching losses with a peak efficiency of >97%. This design is configurable to work as a two-level or three-level rectifier.
97%
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Vin | VOut1 (V (DC)) | IOut1 (A) | Isolierungstyp | fswitch (kHz) | ∫Udt (Vµs) | NPRI : NSEC | L (µH) | VT (V (RMS)) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Pins (Value) (pcs) | Reihen | Gender | Verpackung | Muster | |
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150060VS55040 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCD SMT Mono-color Chip LED Diffused | 573 | Hellgrün | 575 | 60 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.4 | – | – | – | Tape and Reel | |||
742792662 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | – | – | – | – | SMT | 1000 | 1050 | 120 MHz | 830 | 0.3 | Breitband | 600 | 186 | 0.8 | – | – | – | – | |||
74279228260 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | – | – | – | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | – | – | – | – | SMT | 26 | 39 | 515 MHz | 6500 | 0.008 | High Current | 6500 | 33 | 0.8 | – | – | – | – | |||
885012206040 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 10 nF | ±10% | 16 | 0603 | -55 °C up to +125 °C | 3.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
61300411021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Angled Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 10.16 | – | – | – | – | – | – | – | – | – | – | – | THT | – | – | – | – | – | Angled | 3000 | – | – | 4 | Single | Pin Header | Beutel | ||
750313638 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PPTI Push-Pull Transformers | – | – | – | – | – | – | – | – | – | – | 1209 | -40 °C up to +125 °C | – | – | – | 9.14 | 12.7 | – | 5 V (DC) | 5 | 0.65 | Reinforced | 300 - 620 | 10 | 1:1.3 | 340 | 5000 | SMT | – | – | – | – | – | – | – | – | 7.62 | – | – | – | Tape and Reel |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
150060VS55040 | SPEC | ||
742792662 | SPEC | ||
74279228260 | SPEC | ||
885012206040 | SPEC | ||
885012206095 | SPEC | ||
61300411021 | SPEC | – | |
750313638 | SPEC | – |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Vin | VOut1 (V (DC)) | IOut1 (A) | Isolierungstyp | fswitch (kHz) | ∫Udt (Vµs) | NPRI : NSEC | L (µH) | VT (V (RMS)) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Pins (Value) (pcs) | Reihen | Gender | Verpackung | Muster |
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