Topologie | Sonstige Topologie |
IC-Revision | E2 |
Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IR 1 (mA) | ISAT (mA) | RDC (mΩ) | fres (MHz) | IR (mA) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster | |
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885012005061 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 100 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | |||
742792609 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | 1.6 | 0.8 | 0.8 | 0.3 | – | – | 2000 | – | – | – | 2000 | SMT | 30 | 40 | 1000 MHz | 3000 | 0.04 | High Current | |||
74479775233 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PMI Power-Multilayer-Induktivität | – | – | – | 0805 | -40 °C up to +125 °C | 25 | – | – | 2 | 1.2 | 1 | – | – | 3.3 | 700 | 280 | 200 | 30 | – | SMT | – | – | – | 1000 | 0.25 | Low RDC | |||
74404084101 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | – | – | – | 8040 | -40 °C up to +125 °C | – | – | – | 8 | 8 | 4.2 | – | – | 100 | – | 1500 | 290 | 6.4 | 1200 | SMT | – | – | – | – | – | – | |||
744043102 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TPC SMT-Speicherdrossel | – | – | – | 4828 | -40 °C up to +125 °C | – | – | – | 4.8 | 4.8 | 2.8 | – | – | 1000 | – | 80 | – | 2.3 | 140 | SMT | – | – | – | – | 7 | – |
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885012005061 | SPEC | ||
742792609 | SPEC | ||
74479775233 | SPEC | ||
74404084101 | SPEC | ||
744043102 | SPEC |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IR 1 (mA) | ISAT (mA) | RDC (mΩ) | fres (MHz) | IR (mA) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster |
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