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Texas Instruments TDA4VM | Demoboard J721EXSKG01EVM

TDA4VM Jacinto Processors for ADAS and Autonomous Vehicles

Details

TopologieSonstige Topologie

Beschreibung

The J721EXCP01EVM common processor board for Jacinto™ 7 processors lets you evaluate vision analytics and networking applications in automotive and industrial markets. The common processor board is compatible with all Jacinto 7 processors system-on-modules (sold separately or as a bundle) and includes basic connectivity to Input/Output, JTAG and various expansion cards.This multi-part evaluation platform is designed to lower overall evaluation cost, speed up development and reduce time-to-market.The EVM is supported by Processor SDK-Vision, which includes foundational drivers, compute and vision kernels, and example application frameworks and demonstrations that show you how to take advantage of the powerful, heterogeneous architecture of Jacinto 7 processors.

Eigenschaften

  • C7x floating point, vector DSP ,up to 1.0 GHz, 80 GFLOPS, 256 GOPS
  • Deep-learning matrix multiply accelerator (MMA),up to 8 TOPS (8b) at 1.0 GHz
  • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0 GHz -1MB shared L2 cache per dual-core Cortex®A72 cluster
  • 32KB L1 DC ache and 48KB L1 IC ache per Cortex®-A72 core
  • Six Arm® Cortex®-R5F MCUs at up to 1.0 GHz
  • 16K I-Cache, 16K D-Cache, 64K L2 TCM
  • Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem
  • Four Arm® Cortex®-R5F MCUs in general compute partition
  • Two C66x floating point DSP, up to 1.35 GHz, 40 GFLOPS, 160 GOPS
  • 3D GPU Power VR® Rogue 8XE GE8430, up to 750 MHz, 96 GFLOPS,6 G pix/sec
  • Custom-designed interconnect fabric supporting near max processing entitlement

Typische Anwendungen

  • Advanced surround view and park assistance systems, Autonomous sensor fusion / perception systems including camera, radar and lidar sensors, Mono and multi-sensor Front camera systems

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
Raster
(mm)
MontageartIR 1
(A)
Arbeitsspannung
(V (AC))
PCB/Kabel/PanelKontaktwiderstand
(mΩ)
Tol. RfTol. fStabilität
(ppm)
Cload
(pF)
BetriebstemperaturCTol. CVR
(V (DC))
BauformQRISOKeramiktypW
(mm)
Fl
(mm)
L
(µH)
IRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC max.
(mΩ)
fres
(MHz)
Schlüsselweite
(mm)
TiØ ID
(mm)
Ø OD
(mm)
VPE
(pcs)
AnwendungInterface typLeiterplattendicke
(mm)
PolesL
(mm)
DampfphasenprozessH
(mm)
Betätigungskraft (Value)
(g)
Elektrische Lebensdauer
(Cycles)
Actuator-FarbePins
(pcs)
ReihenG
(mm)
GenderTypIR
(A)
Verpackung Muster
150040RS73220SPEC
6 Dateien WL-SMCC SMT Mono-color Chip LED Compact 624 Rot 632 110 2 AlInGaP 120 SMT -40 °C up to +85 °C 0402 0.5 1 0.25
744373240047SPEC
8 Dateien WE-LHMI SMT Speicherdrossel SMT -40 °C up to +125 °C 4020 4.06 0.47 8.7 10.4 19.6 14 122 3000 4.45 1.8 2
885012005015SPEC
8 Dateien WCAP-CSGP MLCCs 10 V(DC) -55 °C up to +125 °C220 pF ±5% 10 0402 100010 GΩ NP0 Klasse I 0.5 0.25 10000 1 0.5 7" Tape & Reel
61900311121SPEC
6 Dateien WR-WTB 2.54 mm Male Locking Header 2.54 THT 3 250 PCB 20 max. -40 °C up to +105 °C1000 MΩ 7.62 3 Männlich Vertikal 3 Beutel
61304021121SPEC
6 Dateien WR-PHD 2.54 mm THT Dual Pin Header 2.54 THT 250 20 max. -40 °C up to +105 °C1000 MΩ 50.8 40 Dual Pin Header Gerade 3 Beutel
629105150521SPEC
6 Dateien WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current SMT 3 30 30 max. -40 °C up to +85 °C1000 MΩ Micro USB 2.0 Type B 5 Receptacle Horizontal 3 Tape and Reel
416131160804SPEC
6 Dateien WS-DISV Small Compact SMT Flat Actuator with Top Tape 1.27 mm 1.27 0.025 -40 °C up to +85 °C 24100 MΩ 2000 4 6.25 Ja 500 1000 Weiß 4 Tape and Reel
430182050816SPEC
5 Dateien WS-TASV SMT Tact Switch 6x6 mm -40 °C up to +85 °C 12100 MΩ 1000 nicht spezifiziert 5 160 1000000 Schwarz 0.05 Tape and Reel
970120151SPEC
3 Dateien WA-SSTII Steel Spacer Stud, metric, internal/internal -55 °C up to +150 °C 5 M2.5 12 Karton
9774015243RSPEC
6 Dateien WA-SMSI SMT Stahl Spacer mit Innengewinde M2 -55 °C up to +150 °C M2 2.8 4.35 1200 1.5 Tape and Reel
632723300011SPEC
6 Dateien WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT THR 20 30 max. -40 °C up to +105 °C1000 MΩ 700 USB 3.1 Type C 1.6 24 1.9 Receptacle Horizontal 5 Tape and Reel
61300211121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header 2.54 THT 250 20 max. -40 °C up to +105 °C1000 MΩ 5.08 2 Single Pin Header Gerade 3 Beutel
61300311121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header 2.54 THT 250 20 max. -40 °C up to +105 °C1000 MΩ 7.62 3 Single Pin Header Gerade 3 Beutel
61300611121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header 2.54 THT 250 20 max. -40 °C up to +105 °C1000 MΩ 15.24 6 Single Pin Header Gerade 3 Beutel
62000311121SPEC
6 Dateien WR-PHD 2.00 mm THT Pin Header 2 THT 2 200 20 max. -40 °C up to +105 °C1000 MΩ 6 3 Single Pin Header Gerade 2 Beutel
687140183622SPEC
7 Dateien WR-FPC 0.50 mm SMT ZIF Horizontal Top Contact Low Profile 0.5 SMT 50 30 max. -25 °C up to +85 °C100 MΩ 4000 25.7 Schwarz 40 Horizontal 0.4 Tape and Reel
830058124SPEC
5 Dateien WE-XTAL Schwingquarz24 MHz ±20ppm 30 18 -40 °C up to +85 °C CFPX-180 2.5 3.2 0.8
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
Raster
(mm)
MontageartIR 1
(A)
Arbeitsspannung
(V (AC))
PCB/Kabel/PanelKontaktwiderstand
(mΩ)
Tol. RfTol. fStabilität
(ppm)
Cload
(pF)
BetriebstemperaturCTol. CVR
(V (DC))
BauformQRISOKeramiktypW
(mm)
Fl
(mm)
L
(µH)
IRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC max.
(mΩ)
fres
(MHz)
Schlüsselweite
(mm)
TiØ ID
(mm)
Ø OD
(mm)
VPE
(pcs)
AnwendungInterface typLeiterplattendicke
(mm)
PolesL
(mm)
DampfphasenprozessH
(mm)
Betätigungskraft (Value)
(g)
Elektrische Lebensdauer
(Cycles)
Actuator-FarbePins
(pcs)
ReihenG
(mm)
GenderTypIR
(A)
Verpackung Muster