Applications
- High current Wire-to-Board connections up to 500 A
- Mounting of copper bars on PCBs
- Installation of laminated fuses
- Suitable for rough environmental conditions
| General Information | |
|---|---|
| Operating Temperature | -55 °C up to +150 °C |
| Material | Brass |
| Surface | Tin |
| Execution | Press-Fit |
| Packaging Properties | |
|---|---|
| Packaging | Bulk |
Application Notes
Products
| Order Code | Datasheet | Downloads | Status | W (mm) | H (mm) | IR (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Design Kit | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 7461148 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 7 | 6 | 130 | M2.5 | 6 | 8 | – | |
 | 7461086 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 9 | 6 | 175 | M4 | 6 | 12 | 746701 | |
 | 7460408 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 9 | 6 | 175 | M5 | 6 | 12 | 746701 | |
 | 7461059 | SPEC PCN pendingDue to a pending PCN, a modification of the component will be implemented soon. Please find the PCN below. If you have further questions please get in contact with our sales staff. | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 13 | 13.5 | 240 | M6 | 13.5 | 16 | 746701 | |
 | 7461090 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 16 | 13.5 | 350 | M8 | 13.5 | 20 | 746701 | |
 | 7461060 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 16 | 17.5 | 350 | M10 | 17.5 | 20 | 746701 |
| Order Code | Datasheet | |
|---|---|---|
| 7461148 | SPEC |
| 7461086 | SPEC |
| 7460408 | SPEC |
| 7461059 | SPEC PCN pendingDue to a pending PCN, a modification of the component will be implemented soon. Please find the PCN below. If you have further questions please get in contact with our sales staff. |
| 7461090 | SPEC |
| 7461060 | SPEC |
| Samples |
|---|
| Order Code | Datasheet | Downloads | Status | W (mm) | H (mm) | IR (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Design Kit | Samples |
|---|
REDCUBE PRESS-FIT
Applications, Performance & Press-Fit Process
Applications
The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.
- High current Wire-to-Board & Board-to-Board
- Mounting of copper bars
- Angled assembling of cable, PCB and housing
- Mounting of IGBT modules
Remarkable Performance
With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.
- Simple & quick processing
- No cold solder joints
- High process safety
- Low self heating
- Two-sided mounting of PCBs
PRESS-FIT Process
Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 500 A at this low heat development.
- Homogeneous material transition between pin and through-hole plating
- Contact resistance less than 200 μΩ
- Gastight electrical and mechanical connection
- Extremely strong mechanical connection
Mates with
Assortments
Articles from this product series can be found in the following assortments:
Videos
#askLorandt explains: REDCUBE PRESS-FIT Process
Videos
Würth Elektronik Webinar: REDCUBE - Everything about high currents on the printed circuit board
Videos
Würth Elektronik Webinar: REDCUBE HighPower Terminals for ampacity of 50-500 A