Applications
- High current Wire-to-Board connections up to 500 A
- Mounting of copper bars on PCBs
- Installation of laminated fuses
- Suitable for rough environmental conditions
| General Information | |
|---|---|
| Operating Temperature | -55 °C up to +150 °C |
| Material | Brass |
| Surface | Tin |
| Execution | Press-Fit |
| Packaging Properties | |
|---|---|
| Packaging | Bulk |
Application Notes
Products
| Order Code | Datasheet | Downloads | Status | W (mm) | H (mm) | IR (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Design Kit | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 7461148 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 7 | 6 | 130 | M2.5 | 6 | 8 | – | |
 | 7461086 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 9 | 6 | 175 | M4 | 6 | 12 | 746701 | |
 | 7460408 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 9 | 6 | 175 | M5 | 6 | 12 | 746701 | |
 | 7461059 | SPEC PCN pendingDue to a pending PCN there will be a new datasheet revision issued for this order code soon. Please find the actual as well based on valid PCN date the new revision datasheet below. If you have further questions please get in contact with our sales staff. | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 13 | 13.5 | 240 | M6 | 13.5 | 16 | 746701 | |
 | 7461090 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 16 | 13.5 | 350 | M8 | 13.5 | 20 | 746701 | |
 | 7461060 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 16 | 17.5 | 350 | M10 | 17.5 | 20 | 746701 |
| Order Code | Datasheet | |
|---|---|---|
| 7461148 | SPEC |
| 7461086 | SPEC |
| 7460408 | SPEC |
| 7461059 | SPEC PCN pendingDue to a pending PCN there will be a new datasheet revision issued for this order code soon. Please find the actual as well based on valid PCN date the new revision datasheet below. If you have further questions please get in contact with our sales staff. |
| 7461090 | SPEC |
| 7461060 | SPEC |
| Samples |
|---|
| Order Code | Datasheet | Downloads | Status | W (mm) | H (mm) | IR (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Design Kit | Samples |
|---|
REDCUBE PRESS-FIT
Applications, Performance & Press-Fit Process
Applications
The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.
- High current Wire-to-Board & Board-to-Board
- Mounting of copper bars
- Angled assembling of cable, PCB and housing
- Mounting of IGBT modules
Remarkable Performance
With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.
- Simple & quick processing
- No cold solder joints
- High process safety
- Low self heating
- Two-sided mounting of PCBs
PRESS-FIT Process
Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 500 A at this low heat development.
- Homogeneous material transition between pin and through-hole plating
- Contact resistance less than 200 μΩ
- Gastight electrical and mechanical connection
- Extremely strong mechanical connection
Mates with
Assortments
Articles from this product series can be found in the following assortments:
Videos
#askLorandt explains: REDCUBE PRESS-FIT Process
Videos
Würth Elektronik Webinar: REDCUBE - Everything about high currents on the printed circuit board
Videos
Würth Elektronik Webinar: REDCUBE HighPower Terminals for ampacity of 50-500 A