OverviewAll product unitsProduct unitAutomotiveProduct groupREDCUBE TerminalsProduct seriesWP-PFEFUA REDCUBE PRESS-FIT with External Thread

WP-PFEFUA REDCUBE PRESS-FIT with External Thread NEW

WP-PFEFUA REDCUBE PRESS-FIT with External Thread

Applications

  • High current Wire-to-Board connections up to 250 A
  • Mounting of copper bars on PCBs
  • Installation of laminated fuses
  • Installation of IGBT modules
  • Suitable for rough environmental condition

Products

Order Code Data­sheet DownloadsW
(mm)
H
(mm)
IR
(A)
Tl
(mm)
Pins (Value)
(pcs)
Samples
786203073SPEC
3 files 7 10.5 130 4 9
786203074SPEC
3 files 7 12 130 4.6 9
786203075SPEC
3 files 7 15 130 6.5 9
786203095SPEC
3 files 9 15.5 180 6.5 16
786203106SPEC
3 files 10 17.5 180 8 16
786203146SPEC
3 files 14 18.5 250 8 16
786203148SPEC
3 files 14 23.5 250 10.5 16
Order Code Data­sheet
786203073SPEC
786203074SPEC
786203075SPEC
786203095SPEC
786203106SPEC
786203146SPEC
786203148SPEC
Samples
Order Code Data­sheet DownloadsW
(mm)
H
(mm)
IR
(A)
Tl
(mm)
Pins (Value)
(pcs)
Samples

REDCUBE PRESS-FIT

Applications, Perfomance & Press-Fit Process

Applications

The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.

  • High current Wire-to-Board connections up to 250 A
  • Mounting of copper bars on PCBs
  • Installation of laminated fuses 
  • Installation of IGBT modules
  • Suitable for rough enviromental condition

Remarkable Performance

With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.

  • Simple & quick processing
  • No cold solder joints
  • High process safety
  • Low self heating
  • Two-sided mounting of PCBs

PRESS-FIT Process

Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 250 A at this low heat development.

  • Homogeneous material transition between pin and through-hole plating
  • Contact resistance less than 200 μΩ
  • Gastight electrical and mechanical connection
  • Extremely strong mechanical connection