Applications
- High current Wire-to-Board connections up to 250 A
- Mounting of copper bars on PCBs
- Installation of laminated fuses
- Installation of IGBT modules
- Suitable for rough environmental condition
Products
Order Code | Datasheet | Downloads | W (mm) | H (mm) | IR (A) | Tl (mm) | Pins (Value) (pcs) | Samples |
---|---|---|---|---|---|---|---|---|
786203073 | SPEC | 3 files | 7 | 10.5 | 130 | 4 | 9 | |
786203074 | SPEC | 3 files | 7 | 12 | 130 | 4.6 | 9 | |
786203075 | SPEC | 3 files | 7 | 15 | 130 | 6.5 | 9 | |
786203095 | SPEC | 3 files | 9 | 15.5 | 180 | 6.5 | 16 | |
786203106 | SPEC | 3 files | 10 | 17.5 | 180 | 8 | 16 | |
786203146 | SPEC | 3 files | 14 | 18.5 | 250 | 8 | 16 | |
786203148 | SPEC | 3 files | 14 | 23.5 | 250 | 10.5 | 16 |
Order Code | Datasheet |
---|---|
786203073 | SPEC |
786203074 | SPEC |
786203075 | SPEC |
786203095 | SPEC |
786203106 | SPEC |
786203146 | SPEC |
786203148 | SPEC |
Samples |
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Order Code | Datasheet | Downloads | W (mm) | H (mm) | IR (A) | Tl (mm) | Pins (Value) (pcs) | Samples |
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REDCUBE PRESS-FIT
Applications, Perfomance & Press-Fit Process
Applications
The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.
- High current Wire-to-Board connections up to 250 A
- Mounting of copper bars on PCBs
- Installation of laminated fuses
- Installation of IGBT modules
- Suitable for rough enviromental condition
Remarkable Performance
With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.
- Simple & quick processing
- No cold solder joints
- High process safety
- Low self heating
- Two-sided mounting of PCBs
PRESS-FIT Process
Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 250 A at this low heat development.
- Homogeneous material transition between pin and through-hole plating
- Contact resistance less than 200 μΩ
- Gastight electrical and mechanical connection
- Extremely strong mechanical connection