Applications
- Solderable high current Wire-to-Board & Board-to-Board connections with a focus on automated assembly
- IMS boards or one layer applications
General Information | |
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Material | Brass |
Surface | Tin |
Operating Temperature | -55 °C up to +150 °C |
Electrical Properties | |
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IR | 50 A; 70 A |
Packaging Properties | |
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Packaging | Bulk; Tape and Reel |
Application Notes
Products
Order Code | Datasheet | Downloads | Status | H (mm) | Ø OD (mm) | IR (A) | Ti | Tl (mm) | Design Kit | Samples | |
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746600330 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | 3 | 7 | 50 | M3 | 4 | – | ||
746600330R | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | 3 | 7 | 50 | M3 | 4 | – | ||
746600430 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | 3 | 7 | 50 | M4 | 4 | 746701 | ||
746600430R | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | 3 | 7 | 50 | M4 | 4 | – | ||
7466003 | SPEC | 5 files | Active i| Production is active. Expected lifetime: >10 years. | 5 | 7 | 50 | M3 | 6 | – | ||
7466004 | SPEC | 5 files | Active i| Production is active. Expected lifetime: >10 years. | 5 | 7 | 50 | M4 | 6 | – | ||
7466003R | SPEC | 5 files | Active i| Production is active. Expected lifetime: >10 years. | 5 | 7 | 50 | M3 | 6 | – | ||
7466004R | SPEC | 5 files | Active i| Production is active. Expected lifetime: >10 years. | 5 | 7 | 50 | M4 | 6 | – | ||
7466005 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | 5 | 9 | 70 | M5 | 6 | – | ||
7466005R | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | 5 | 9 | 70 | M5 | 6 | – |
Order Code | Datasheet | |
---|---|---|
746600330 | SPEC | |
746600330R | SPEC | |
746600430 | SPEC | |
746600430R | SPEC | |
7466003 | SPEC | |
7466004 | SPEC | |
7466003R | SPEC | |
7466004R | SPEC | |
7466005 | SPEC | |
7466005R | SPEC |
Samples |
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Order Code | Datasheet | Downloads | Status | H (mm) | Ø OD (mm) | IR (A) | Ti | Tl (mm) | Design Kit | Samples |
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REDCUBE SMT & THR
Applications, Characteristics & Design
Applications
REDCUBE SMD and THR are the result of the growing demand in electronic market: high current technology in combination with fully automated, timesaving processing.
- High current Wire-to-Board & Board-to-Board connections
- Angled assembling of cable, PCB or housing
Impressive Characteristics
A large connecting area of REDCUBE SMD achieves a low contact resistance and best holding forces. The small size of REDCUBE SMD allows a high packing density without critical heat development on the PCB.
- Simple and fast automated assembly
- High packing density
- Efficient and timesaving soldering process
- Angled assembling of cable, PCB or housing
- Tape & Reel
Special Design
REDCUBE THR have a special design for best soldering results. Milling from solid material the torques are significant better compared to stamped contacts. REDCUBE THR have the highest ampacity of fully automatically processed high-current components.
- Optimal current distribution in multilayer applications
- Fully automated reflow soldering
- High mechanical stability
- Low profile
- Tape & Reel
- Low heat development
Assortments
Articles from this product series can be found in the following assortments:
Videos
Würth Elektronik Webinar: REDCUBE - Everything about high currents on the printed circuit board
Videos
Würth Elektronik Webinar: REDCUBE HighPower Terminals for ampacity of 50-500 A