IC-Hersteller Onsemi
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (172)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (929)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (110)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.0 |
Beschreibung
The NCP163 is an LDO (Low Dropout Regulator) capable of supplying 250 mA output current. Designed to meet the requirements of RF and analog circuits, the NCP163 device provides low noise, high PSRR, low quiescent current, and very good load/line transients. The device is designed to work with a 1 µF input and a 1 µF output ceramic capacitor. It is available in two thickness ultra−small 0.35P, 0.65 mm x 0.65 mm Chip Scale Package (CSP), XDFN−4 0.65P, 1 mm x 1 mm and in TSOP5 packages
Eigenschaften
- Ultra High PSRR 92dB at 1 kHz, 60dB at 100 kHz
- Ultra Low Output Noise 6.5 µVRMS
- Ultra Low Quiescent current 12 µA
- Operating Input Voltage Range 2.2V to 5.5V
- Very Low Dropout 80mV at 250mA
- Available in CSP4 0.35P and XDFN4 0.65P package
Typische Anwendungen
- A/D and D/A Converters Power supply / Battery Powered Equipment
- Audio codec / Camera module / Precision Analog Circuits /RF Modules / LP5907 Upgrade
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV typ. (mcd) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF typ. (V) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT1 (A) | ISAT2 (A) | RDC max. (mΩ) | fres (MHz) | Version | Anwendung | Interface typ | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | H (mm) | Betätigungskraft (Value) (g) | Elektrische Lebensdauer (Cycles) | Actuator-Farbe | Dampfphasenprozess | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | Typ | Pins (Value) (pcs) | Reihen | Gender | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060GS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | – | – | – | – | – | – | 430 | – | – | – | 3.2 | – | – | – | InGaN | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | – | – | – | – | – | SMT | – | – | 0.7 | – | – | – | – | – | – | – | – | – | – | – | – | – | Tape and Reel | ||
| 150060YS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 590 | Gelb | 595 | – | – | – | – | – | – | 120 | – | – | – | 2 | – | – | – | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | – | – | – | – | – | SMT | – | – | 0.7 | – | – | – | – | – | – | – | – | – | – | – | – | – | Tape and Reel | ||
 | 74279220321 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0805 | -55 °C up to +125 °C | – | – | – | 2 | 1.2 | 0.5 | – | – | – | 50 | – | SMT | – | – | SMT | – | – | 0.9 | – | – | – | – | 320 | 347 | 170 MHz | 2500 | 108 | High Current | – | – | – | – | ||
 | 150141M173100 | SPEC | – | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SFTW SMT Full-color TOP LED Waterclear | – | Rot & Grün & Blau | – | 465 | 515 | 635 | 470 | 520 | 625 | – | 230 | 950 | 270 | – | 3.2 | 3.2 | 2 | AlInGaP + InGaN | 120 | – | – | – | 3528 | -40 °C up to +85 °C | – | – | – | 3.5 | 2.8 | – | – | – | – | – | – | – | – | – | SMT | – | – | 1.9 | – | – | – | – | – | – | – | – | – | – | – | – | – | Tape and Reel | |
 | 885012205012 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 10 | 0402 | -55 °C up to +125 °C | 5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | ||
| 885012105011 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 220 nF | ±20% | 10 | 0402 | -55 °C up to +85 °C | 5 | 2.3 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | ||
| 885012105013 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 2.2 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | 10 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | ||
 | 434121025816 | SPEC | – | 5 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WS-TASV SMT Tact Switch 6.0x3.8 mm | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 12 | – | -40 °C up to +85 °C | – | 100 MΩ | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 2.5 | 160 | 50000 | Schwarz | nicht spezifiziert | – | – | – | 50 | – | – | – | – | – | Tape and Reel | |
 | 74479275222 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PMCI Power Molded Chip Induktivität | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0805 | -40 °C up to +125 °C | – | – | – | 2 | 1.25 | 0.5 | 2.2 | 1.2 | 2.4 | 190 | 45 | Standard | – | – | SMT | – | – | 1 | – | – | – | – | – | – | – | 2100 | – | – | 2 | – | – | – | ||
 | 629105136821 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | Micro USB 2.0 | Type B | SMT | 1 | 30 | – | – | – | – | – | – | – | – | 1000 | – | Horizontal | 5 | – | Receptacle | Tape and Reel | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | – | – | – | THT | – | 250 | – | – | – | – | – | – | – | – | 3000 | – | Gerade | 2 | Single | Pin Header | Beutel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060GS75000 | SPEC | |
| 150060YS75000 | SPEC | |
| 74279220321 | SPEC | |
| 150141M173100 | SPEC | – |
| 885012205012 | SPEC | |
| 885012105011 | SPEC | |
| 885012105013 | SPEC | |
| 434121025816 | SPEC | – |
| 74479275222 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | |
| 629105136821 | SPEC | – |
| 61300211121 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV typ. (mcd) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF typ. (V) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT1 (A) | ISAT2 (A) | RDC max. (mΩ) | fres (MHz) | Version | Anwendung | Interface typ | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | H (mm) | Betätigungskraft (Value) (g) | Elektrische Lebensdauer (Cycles) | Actuator-Farbe | Dampfphasenprozess | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | Typ | Pins (Value) (pcs) | Reihen | Gender | Verpackung | Muster |
|---|