IC-Hersteller STMicroelectronics
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
STMicroelectronics STM32F767ZIT6 | Demoboard STEVAL-ETH001V1
High-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1 |
Beschreibung
The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm® double-precision and single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.Advanced peripherals include two SDMMC interfaces, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices operate in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. Dedicated supply inputs for USB (OTG_FS and OTG_HS) and SDMMC2 (clock, command and 4-bit data) are available on all the packages except LQFP100 for a greater power supply choice.The supply voltage can drop to 1.7 V with the use of an external power supply supervisor. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices offer devices in 11 packages ranging from 100 pins to 216 pins. The set of included peripherals changes with the device chosen.These features make the STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx microcontrollers suitable for a wide range of applications.
Eigenschaften
- Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator™ and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.
- Memories
- Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write - SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
- Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
- Dual mode Quad-SPI
- Graphics
- Chrom-ART Accelerator™ (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
- Hardware JPEG codec
- LCD-TFT controller supporting up to XGA resolution
- MIPI® DSI host controller supporting up to 720p 30 Hz resolution
- Clock, reset and supply management
- 1.7 V to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- Dedicated USB power
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC (1% accuracy)
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
- Low-power
- Sleep, Stop and Standby modes
- VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM
- 3×12-bit, 2.4 MSPS ADC: up to 24 channels
- Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters
- 2×12-bit D/A converters
- General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
- Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
- Debug mode
- SWD & JTAG interfaces
- Cortex®-M7 Trace Macrocell™
- Up to 168 I/O ports with interrupt capability
- Up to 164 fast I/Os up to 108 MHz
- Up to 166 5 V-tolerant I/Os
- Up to 28 communication interfaces
- Up to 4 I2C interfaces (SMBus/PMBus)
- Up to 4 USARTs/4 UARTs (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
- Up to 6 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2S for audio
- 2 x SAIs (serial audio interface)
- 3 × CANs (2.0B Active) and 2x SDMMCs
- SPDIFRX interface
- HDMI-CEC
- MDIO slave interface
- Advanced connectivity
- USB 2.0 full-speed device/host/OTG controller with on-chip PHY
- USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
- 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII
- 8- to 14-bit camera interface up to 54 Mbyte/s
- True random number generator
- CRC calculation unit
- RTC: subsecond accuracy, hardware calendar
- 96-bit unique ID
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | xPxC | LED | Montageart | Anwendungssystem | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak G typ. (nm) | λPeak Y typ. (nm) | IV typ. (mcd) | IV G typ. (mcd) | IV Y typ. (mcd) | VF typ. (V) | VF G typ. (V) | VF Y typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | VOP (V) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | Testbedingung IR 2 | Z @ 1 GHz (Ω) | Typ | RDC max. (mΩ) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 74438323100 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MAPI SMT-Speicherdrossel | 2 | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 2510 | -40 °C up to +125 °C | – | – | – | – | 2.5 | 2 | 1 | – | – | 10 | 0.9 | 1.7 | 733 | 25 | 80 | – | – | – | – | – | – | – | 843 | ||
 | 691253510002 | SPEC | – | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Serie 2535 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp | 2 | Rising Cage Clamp | PCB | Ja | 12 to 30 (AWG) 0.05 to 3.31 (mm²) | – | – | THT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -30 °C up to +120 °C | – | – | – | – | 10.16 | – | – | – | Karton | – | – | – | – | – | – | – | – | – | – | – | – | Horizontal | – | |
 | 691311500103 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Serie 311 - 5.08 mm Close Vertical PCB Header | 3 | Pluggable | PCB | Nein | – | – | – | THT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | 17.24 | – | – | – | Karton | – | – | – | – | – | – | – | – | – | – | – | – | Vertikal | – | |
 | 742792040 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0805 | -55 °C up to +125 °C | – | – | – | – | 2 | 1.2 | 0.0009 | 0.5 | – | – | – | – | – | – | – | 600 | 700 | 150 MHz | 2000 | ΔT = 40 K | 193 | High Current | 150 | ||
 | 885012005007 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 10 pF | ±5% | 10 | 0402 | -55 °C up to +125 °C | 600 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012005013 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 pF | ±5% | 10 | 0402 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205031 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205037 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205038 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 pF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205052 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 22 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012105013 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 2.2 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 10 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012105018 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | – | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012206046 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0603 | -55 °C up to +125 °C | – | 3.5 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012206075 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 470 nF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 1.1 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 615008185221 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-MJ Modular Jack Horizontal Shielded w. LED and EMI Panel Finger 8P8C Tab Down | – | – | – | – | – | 8P8C | gelb-grün | THT | CAT 3 | – | – | – | 570 | 590 | – | 13 | 8 | – | 2.3 | 2.3 | – | 140 | – | – | – | – | -40 °C up to +85 °C | – | – | 1000 MΩ | – | – | – | – | – | Tray | – | – | – | – | – | – | – | – | – | – | – | – | Horizontal | – | |
 | 150040RS73240 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCC SMT Mono-color Chip LED Compact | – | – | – | – | – | – | – | SMT | – | 625 | Rot | 630 | – | – | 100 | – | – | 2 | – | – | AlInGaP | 120 | – | – | – | 0402 | -40 °C up to +85 °C | – | – | – | – | 1 | 0.5 | 0.4 | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 150040VS73240 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCC SMT Mono-color Chip LED Compact | – | – | – | – | – | – | – | SMT | – | 570 | Hellgrün | 572 | – | – | 50 | – | – | 2 | – | – | AlInGaP | 120 | – | – | – | 0402 | -40 °C up to +85 °C | – | – | – | – | 1 | 0.5 | 0.4 | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 150040AS73220 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCC SMT Mono-color Chip LED Compact | – | – | – | – | – | – | – | SMT | – | 605 | Amber | 609 | – | – | 80 | – | – | 2 | – | – | AlInGaP | 120 | – | – | – | 0402 | -40 °C up to +85 °C | – | – | – | – | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 74269241601 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TMSB SMT-Ferrit | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | – | 1 | 0.5 | 0.5 | 0.25 | – | – | – | – | 220 | – | – | 600 | 720 | 211 MHz | – | – | 218 | Breitband | 250 |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | xPxC | LED | Montageart | Anwendungssystem | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak G typ. (nm) | λPeak Y typ. (nm) | IV typ. (mcd) | IV G typ. (mcd) | IV Y typ. (mcd) | VF typ. (V) | VF G typ. (V) | VF Y typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | VOP (V) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | Testbedingung IR 2 | Z @ 1 GHz (Ω) | Typ | RDC max. (mΩ) | Muster |
|---|