IC-Hersteller STMicroelectronics

IC-Hersteller (99)

STMicroelectronics STM32F767ZIT6 | Demoboard STEVAL-ETH001V1

High-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM

Details

TopologieSonstige Topologie
IC-Revision1

Beschreibung

The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm® double-precision and single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.Advanced peripherals include two SDMMC interfaces, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices operate in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. Dedicated supply inputs for USB (OTG_FS and OTG_HS) and SDMMC2 (clock, command and 4-bit data) are available on all the packages except LQFP100 for a greater power supply choice.The supply voltage can drop to 1.7 V with the use of an external power supply supervisor. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices offer devices in 11 packages ranging from 100 pins to 216 pins. The set of included peripherals changes with the device chosen.These features make the STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx microcontrollers suitable for a wide range of applications.

Eigenschaften

  • Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator™ and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.
  • Memories
  • Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write - SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
  • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
  • Dual mode Quad-SPI
  • Graphics
  • Chrom-ART Accelerator™ (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
  • Hardware JPEG codec
  • LCD-TFT controller supporting up to XGA resolution
  • MIPI® DSI host controller supporting up to 720p 30 Hz resolution
  • Clock, reset and supply management
  • 1.7 V to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • Dedicated USB power
  • 4-to-26 MHz crystal oscillator
  • Internal 16 MHz factory-trimmed RC (1% accuracy)
  • 32 kHz oscillator for RTC with calibration
  • Internal 32 kHz RC with calibration
  • Low-power
  • Sleep, Stop and Standby modes
  • VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM
  • 3×12-bit, 2.4 MSPS ADC: up to 24 channels
  • Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters
  • 2×12-bit D/A converters
  • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
  • Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
  • Debug mode
  • SWD & JTAG interfaces
  • Cortex®-M7 Trace Macrocell™
  • Up to 168 I/O ports with interrupt capability
  • Up to 164 fast I/Os up to 108 MHz
  • Up to 166 5 V-tolerant I/Os
  • Up to 28 communication interfaces
  • Up to 4 I2C interfaces (SMBus/PMBus)
  • Up to 4 USARTs/4 UARTs (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
  • Up to 6 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2S for audio
  • 2 x SAIs (serial audio interface)
  • 3 × CANs (2.0B Active) and 2x SDMMCs
  • SPDIFRX interface
  • HDMI-CEC
  • MDIO slave interface
  • Advanced connectivity
  • USB 2.0 full-speed device/host/OTG controller with on-chip PHY
  • USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
  • 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII
  • 8- to 14-bit camera interface up to 54 Mbyte/s
  • True random number generator
  • CRC calculation unit
  • RTC: subsecond accuracy, hardware calendar
  • 96-bit unique ID

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktseriePins (Value)
(pcs)
AnwendungPCB/Kabel/PanelModularityWire SectionxPxCTabEMILEDMontageartAnwendungssystemλDom typ.
(nm)
FarbeλPeak typ.
(nm)
λPeak G typ.
(nm)
λPeak Y typ.
(nm)
IV typ.
(mcd)
IV G typ.
(mcd)
IV Y typ.
(mcd)
VF typ.
(V)
VF G typ.
(V)
VF Y typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
VOP
(V)
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
Testbedingung IR 2Z @ 1 GHz
(Ω)
TypRDC max.
(mΩ)
Muster
74438323100SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-MAPI SMT-Speicherdrossel 2 SMT 2510 -40 °C up to +125 °C 2.5 2 1 10 0.9 1.7 733 25 80 843
691253510002SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-TBL Serie 2535 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp 2 Rising Cage Clamp PCB Ja 12 to 30 (AWG) 0.05 to 3.31 (mm²) THT -30 °C up to +120 °C 10.16 Karton Horizontal
691311500103SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-TBL Serie 311 - 5.08 mm Close Vertical PCB Header 3 Pluggable PCB Nein THT -40 °C up to +105 °C 17.24 Karton Vertikal
742792040SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-CBF SMT-Ferrit SMT 0805 -55 °C up to +125 °C 2 1.2 0.0009 0.5 600 700 150 MHz 2000 ΔT = 40 K 193 High Current 150
885012005007SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)10 pF ±5% 10 0402 -55 °C up to +125 °C 60010 GΩ NP0 Klasse I 1 0.5 0.5 0.25 7" Tape & Reel
885012005013SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)100 pF ±5% 10 0402 -55 °C up to +125 °C 100010 GΩ NP0 Klasse I 1 0.5 0.5 0.25 7" Tape & Reel
885012205031SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC)10 nF ±10% 16 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012205037SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 16 0402 -55 °C up to +125 °C 55 GΩ X7R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012205038SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)100 pF ±10% 25 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012205052SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)22 nF ±10% 25 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012105013SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)2.2 µF ±20% 10 0402 -55 °C up to +85 °C 100.05 GΩ X5R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012105018SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)100 nF ±20% 25 0402 -55 °C up to +85 °C 105 GΩ X5R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012206046SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 16 0603 -55 °C up to +125 °C 3.55 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012206075SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)470 nF ±10% 25 0603 -55 °C up to +125 °C 101.1 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012206095SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 50 V(DC)100 nF ±10% 50 0603 -55 °C up to +125 °C 35 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
615008185221SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-MJ Modular Jack Horizontal Shielded w. LED and EMI Panel Finger 8P8C Tab Down 8P8C Down Ja gelb-grün THT CAT 3 570 590 13 8 2.3 2.3 140 -40 °C up to +85 °C1000 MΩ Tray Horizontal
150040RS73240SPEC
7 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCC SMT Mono-color Chip LED Compact SMT 625 Rot 630 100 2 AlInGaP 120 0402 -40 °C up to +85 °C 1 0.5 0.4 Tape and Reel
150040VS73240SPEC
7 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCC SMT Mono-color Chip LED Compact SMT 570 Hellgrün 572 50 2 AlInGaP 120 0402 -40 °C up to +85 °C 1 0.5 0.4 Tape and Reel
150040AS73220SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCC SMT Mono-color Chip LED Compact SMT 605 Amber 609 80 2 AlInGaP 120 0402 -40 °C up to +85 °C 1 0.5 0.25
74269241601SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-TMSB SMT-Ferrit SMT 0402 -55 °C up to +125 °C 1 0.5 0.5 0.25 220 600 720 211 MHz 218 Breitband 250
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktseriePins (Value)
(pcs)
AnwendungPCB/Kabel/PanelModularityWire SectionxPxCTabEMILEDMontageartAnwendungssystemλDom typ.
(nm)
FarbeλPeak typ.
(nm)
λPeak G typ.
(nm)
λPeak Y typ.
(nm)
IV typ.
(mcd)
IV G typ.
(mcd)
IV Y typ.
(mcd)
VF typ.
(V)
VF G typ.
(V)
VF Y typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
VOP
(V)
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
Testbedingung IR 2Z @ 1 GHz
(Ω)
TypRDC max.
(mΩ)
Muster