IC manufacturers STMicroelectronics

IC manufacturers (99)

STMicroelectronics STM32F767ZIT6 | Demoboard STEVAL-ETH001V1

High-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM

Overview

TopologyOther Topology
IC revision1

Description

The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm® double-precision and single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.Advanced peripherals include two SDMMC interfaces, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices operate in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. Dedicated supply inputs for USB (OTG_FS and OTG_HS) and SDMMC2 (clock, command and 4-bit data) are available on all the packages except LQFP100 for a greater power supply choice.The supply voltage can drop to 1.7 V with the use of an external power supply supervisor. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices offer devices in 11 packages ranging from 100 pins to 216 pins. The set of included peripherals changes with the device chosen.These features make the STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx microcontrollers suitable for a wide range of applications.

Features

  • Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator™ and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.
  • Memories
  • Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write - SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
  • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
  • Dual mode Quad-SPI
  • Graphics
  • Chrom-ART Accelerator™ (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
  • Hardware JPEG codec
  • LCD-TFT controller supporting up to XGA resolution
  • MIPI® DSI host controller supporting up to 720p 30 Hz resolution
  • Clock, reset and supply management
  • 1.7 V to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • Dedicated USB power
  • 4-to-26 MHz crystal oscillator
  • Internal 16 MHz factory-trimmed RC (1% accuracy)
  • 32 kHz oscillator for RTC with calibration
  • Internal 32 kHz RC with calibration
  • Low-power
  • Sleep, Stop and Standby modes
  • VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM
  • 3×12-bit, 2.4 MSPS ADC: up to 24 channels
  • Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters
  • 2×12-bit D/A converters
  • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
  • Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
  • Debug mode
  • SWD & JTAG interfaces
  • Cortex®-M7 Trace Macrocell™
  • Up to 168 I/O ports with interrupt capability
  • Up to 164 fast I/Os up to 108 MHz
  • Up to 166 5 V-tolerant I/Os
  • Up to 28 communication interfaces
  • Up to 4 I2C interfaces (SMBus/PMBus)
  • Up to 4 USARTs/4 UARTs (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
  • Up to 6 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2S for audio
  • 2 x SAIs (serial audio interface)
  • 3 × CANs (2.0B Active) and 2x SDMMCs
  • SPDIFRX interface
  • HDMI-CEC
  • MDIO slave interface
  • Advanced connectivity
  • USB 2.0 full-speed device/host/OTG controller with on-chip PHY
  • USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
  • 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII
  • 8- to 14-bit camera interface up to 54 Mbyte/s
  • True random number generator
  • CRC calculation unit
  • RTC: subsecond accuracy, hardware calendar
  • 96-bit unique ID

Products

Order Code Data­sheet Simu­lation Downloads Status Product seriesPins (Value)
(pcs)
ApplicationPCB/Cable/PanelModularityWire SectionxPxCTabEMILEDMountApplication SystemλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
λPeak G typ.
(nm)
λPeak Y typ.
(nm)
IV typ.
(mcd)
IV G typ.
(mcd)
IV Y typ.
(mcd)
VF typ.
(V)
VF G typ.
(V)
VF Y typ.
(V)
Chip Technology50% typ.
(°)
CTol. CVR
(V (DC))
SizeOperating TemperatureQDF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
PackagingL
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
VOP
(V)
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Test Condition ZmaxIR 2
(mA)
Test Condition IR 2Z @ 1 GHz
(Ω)
TypeRDC max.
(mΩ)
Samples
74438323100SPEC
9 files Active i| Production is active. Expected lifetime: >10 years.WE-MAPI SMT Power Inductor 2 SMT 2510 -40 °C up to +125 °C 2.5 2 1 10 0.9 1.7 733 25 80 843
691253510002SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WR-TBL Series 2535 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp 2 Rising Cage Clamp PCB Yes 12 to 30 (AWG) 0.05 to 3.31 (mm²) THT -30 °C up to +120 °C 10.16 Box Horizontal
691311500103SPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WR-TBL Series 311 - 5.08 mm Close Vertical PCB Header 3 Pluggable PCB No THT -40 °C up to +105 °C 17.24 Box Vertical
742792040SPEC
9 files Active i| Production is active. Expected lifetime: >10 years.WE-CBF SMT EMI Suppression Ferrite Bead SMT 0805 -55 °C up to +125 °C 2 1.2 0.0009 0.5 600 700 150 MHz 2000 ΔT = 40 K 193 High Current 150
885012005007SPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 10 V(DC)10 pF ±5% 10 0402 -55 °C up to +125 °C 60010 GΩ NP0 Class I 1 0.5 0.5 0.25 7" Tape & Reel
885012005013SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 10 V(DC)100 pF ±5% 10 0402 -55 °C up to +125 °C 100010 GΩ NP0 Class I 1 0.5 0.5 0.25 7" Tape & Reel
885012205031SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 16 V(DC)10 nF ±10% 16 0402 -55 °C up to +125 °C 3.510 GΩ X7R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012205037SPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 16 0402 -55 °C up to +125 °C 55 GΩ X7R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012205038SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 25 V(DC)100 pF ±10% 25 0402 -55 °C up to +125 °C 3.510 GΩ X7R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012205052SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 25 V(DC)22 nF ±10% 25 0402 -55 °C up to +125 °C 3.510 GΩ X7R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012105013SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 10 V(DC)2.2 µF ±20% 10 0402 -55 °C up to +85 °C 100.05 GΩ X5R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012105018SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 25 V(DC)100 nF ±20% 25 0402 -55 °C up to +85 °C 105 GΩ X5R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012206046SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 16 0603 -55 °C up to +125 °C 3.55 GΩ X7R Class II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012206075SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 25 V(DC)470 nF ±10% 25 0603 -55 °C up to +125 °C 101.1 GΩ X7R Class II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012206095SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 50 V(DC)100 nF ±10% 50 0603 -55 °C up to +125 °C 35 GΩ X7R Class II 1.6 0.8 0.8 0.4 7" Tape & Reel
615008185221SPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WR-MJ Modular Jack Horizontal Shielded w. LED and EMI Panel Finger 8P8C Tab Down 8P8C Down Yes yellow-green THT CAT 3 570 590 13 8 2.3 2.3 140 -40 °C up to +85 °C1000 MΩ Tray Horizontal
150040RS73240SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WL-SMCC SMT Mono-color Chip LED Compact SMT 625 Red 630 100 2 AlInGaP 120 0402 -40 °C up to +85 °C 1 0.5 0.4 Tape and Reel
150040VS73240SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WL-SMCC SMT Mono-color Chip LED Compact SMT 570 Bright Green 572 50 2 AlInGaP 120 0402 -40 °C up to +85 °C 1 0.5 0.4 Tape and Reel
150040AS73220SPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WL-SMCC SMT Mono-color Chip LED Compact SMT 605 Amber 609 80 2 AlInGaP 120 0402 -40 °C up to +85 °C 1 0.5 0.25
74269241601SPEC
9 files Active i| Production is active. Expected lifetime: >10 years.WE-TMSB Tiny Multilayer Suppression Bead SMT 0402 -55 °C up to +125 °C 1 0.5 0.5 0.25 220 600 720 211 MHz 218 Wide Band 250
Samples
Order Code Data­sheet Simu­lation Downloads Status Product seriesPins (Value)
(pcs)
ApplicationPCB/Cable/PanelModularityWire SectionxPxCTabEMILEDMountApplication SystemλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
λPeak G typ.
(nm)
λPeak Y typ.
(nm)
IV typ.
(mcd)
IV G typ.
(mcd)
IV Y typ.
(mcd)
VF typ.
(V)
VF G typ.
(V)
VF Y typ.
(V)
Chip Technology50% typ.
(°)
CTol. CVR
(V (DC))
SizeOperating TemperatureQDF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
PackagingL
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
VOP
(V)
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Test Condition ZmaxIR 2
(mA)
Test Condition IR 2Z @ 1 GHz
(Ω)
TypeRDC max.
(mΩ)
Samples