IC-Hersteller Nexperia
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Nexperia GAN3R2-100CBE | Demoboard NX-HB-GAN3R2-BSC
NX-HB-GAN3R2-BSC half-bridge evaluation board using Nexperia power GaN FETs GAN3R2-100CBE
Details
| Topologie | Half-Bridge Converter Nonisolated |
| Eingangsspannung | 60 V |
| Ausgang 1 | 60 V |
| IC-Revision | A |
Beschreibung
The NX-HB-GAN3R2-BSC half-bridge evaluation board provides the elements of a simple buck or boost converter. This enables the basic study of the switching characteristics and efficiency achievable with Nexperia’s 100V E-Mode GaN FETs. The circuit is configured for synchronous rectification, in either buck or boost mode. Selection jumpers allow the use of a single logic input or separate high / low level inputs. The voltage input and output can operate at up to 60 VDC, with a power output > 350 W.
Eigenschaften
- The GAN3R2-100CBE is a a general purpose 100 V, 3.2 mΩ Gallium Nitride (GaN) FET in a 15 bump Wafer Level Chip-Scale Package (WLCSP). It is a normally-off e-mode device offering superior performance.
- Enhancement mode - normally-off power switch
- Ultra high frequency switching capability
- No body diode
- Low gate charge, low output charge
Typische Anwendungen
- AC-to-DC converters, (secondary stage)
- Datacom and telecom (AC-to-DC and DC-to-DC) converters
- Motor drives
- LiDAR (non-automotive)
- Class D audio amplifiers
- Fast battery charging, mobile phone, laptop, tablet and USB type-C chargers
- High frequency DC-to-DC converters in 48 V systems
- High power density and high efficiency power conversion
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | RDC max. (mΩ) | fres (MHz) | Schlüsselweite (mm) | IRIPPLE (mA) | ILeak (µA) | RESR (mΩ) | Ø D (mm) | Schutzart | f | Montageart | Mittelkontakt | H (mm) | Ø OD (mm) | IR 1 (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Reihen | Gender | Typ | IR (A) | Verpackung | Farbe | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | SMT | – | 0.7 | – | – | – | – | – | – | – | – | – | Tape and Reel | – | – | – | – | – | ||
| 150080RS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 625 | Rot | 630 | 150 | 2 | AlInGaP | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | SMT | – | 0.7 | – | – | – | – | – | – | – | – | – | Tape and Reel | – | – | – | – | – | ||
 | 885012206083 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | – | – | – | – | – | ||
| 885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | – | – | – | – | – | ||
 | 691351500002 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Serie 351 - 5.08 mm Vertical | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | 10.16 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Cable | – | – | – | – | – | – | 2 | – | – | Vertikal | 20 | Karton | Grün | Pluggable | Kabel | Nein | 12 to 24 (AWG) 3.31 to 0.205 (mm²) | |
 | 970150485 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WA-SPAII Plastic Spacer Stud, metric, internal/ internal | – | – | – | – | – | – | – | – | – | – | – | -30 °C up to +110 °C | – | – | – | – | 15 | – | – | – | – | – | – | – | – | 8 | – | – | – | – | – | – | – | – | – | – | – | M4 | – | – | – | – | – | – | Beutel | Schwarz | – | – | – | – | |
 | 60900213421 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm Multi-Jumper Jumper with Test Point | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | 1000 MΩ | – | 2.44 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1 | – | Jumper | – | 3 | Beutel | Schwarz | – | – | – | – | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | THT | – | – | – | – | – | – | 2 | Single | Pin Header | Gerade | 3 | Beutel | – | – | – | – | – | |
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | THT | – | – | – | – | – | – | 3 | Single | Pin Header | Gerade | 3 | Beutel | – | – | – | – | – | |
| 885012006079 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | 100 pF | ±5% | 100 | 0603 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | – | – | – | – | – | ||
 | 746600330R | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WP-SMBU REDCUBE SMT with internal through-hole thread | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +150 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | SMT | – | 3 | 7 | 50 | M3 | 4 | – | – | – | – | 50 | Tape and Reel | – | – | – | – | – | |
 | 7443640680B | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-HCF SMT-Hochstrominduktivität | – | – | – | – | – | – | – | – | – | – | 2818 | -40 °C up to +125 °C | – | – | – | – | 27 | 28 | – | 6.8 | 59.2 | 31.9 | 36.3 | 0.97 | 18.8 | – | – | – | – | – | – | – | SMT | – | 18.5 | – | – | – | – | – | – | – | – | 59.2 | – | – | – | – | – | – | ||
 | 60311002111526 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-SMA PCB THT/THR/SMT | – | – | – | – | – | – | – | – | – | – | – | -65 °C up to +165 °C | – | – | 5000 MΩ | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | DC~6 GHz | THT | Ø 1.27 | – | – | – | – | – | – | – | Jack | – | – | Tray | – | – | PCB | – | – | |
 | 66012102111404 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-MMCX PCB THT/SMT | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +155 °C | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | None | DC~6 GHz | SMT | Ø 0.7 | – | – | – | – | – | – | – | Jack | – | – | Tape and Reel with Film | – | – | PCB | – | – | |
 | 875585857007 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-HSAH Advanced High Temperature 125°C | – | – | – | – | – | – | – | 68 µF | ±20% | 63 | – | -55 °C up to +125 °C | – | 8 | – | – | 10.5 | 10.3 | – | – | – | – | – | – | – | – | 1400 | 42.8 | 30 | 10 | – | – | V-Chip SMT | – | – | – | – | – | – | – | – | – | – | – | 15" Tape & Reel | – | – | – | – | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | RDC max. (mΩ) | fres (MHz) | Schlüsselweite (mm) | IRIPPLE (mA) | ILeak (µA) | RESR (mΩ) | Ø D (mm) | Schutzart | f | Montageart | Mittelkontakt | H (mm) | Ø OD (mm) | IR 1 (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Reihen | Gender | Typ | IR (A) | Verpackung | Farbe | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | Muster |
|---|