Topology | Other Topology |
Input voltage | 6-18 V |
As the size of electronic devices shrink, the circuitry inside them must do the same. This trend towards product miniaturization is evident across all industries and creates new design challenges for engineers tasked with fitting solutions in space-constrained designs. To meet increasingly stringent size requirements for compact electronic devices, integrated circuit (IC) designers bring external components inside of their devices to minimize the external component count. Of the various circuits required to build any electronic device, dc-to-dc converters are as challenging to shrink in size as they are ubiquitous—everything needs power—as power supply designers often face the reality that shrinking solution size typically negatively affects performance. For instance, one way to save significant PCB real estate is to use a monolithic dc-to-dc converter that integrates carefully selected power switch devices within the IC package, reducing required external components to a few passive devices. In many cases, the resulting compact design brings the undesirable result of increased power loss in a smaller space for much higher temperature rise when compared with external power switch controller designs. Selecting the right monolithic dc-to-dc converter is critical in designing a power system that is both compact and efficient in order to avoid generating problematic levels of heat
Order Code | Datasheet | Simulation | Downloads | Status | Product series | L (µH) | ISAT,10% (A) | ISAT,30% (A) | RDC max. (mΩ) | fres (MHz) | IRP,40K (A) | Mount | Samples | |
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78438357068 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | WE-MAIA SMT Power Inductor | 6.8 | 3.5 | 7.2 | 74 | 19.5 | 3.75 | SMT |
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78438357068 | SPEC |
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Order Code | Datasheet | Simulation | Downloads | Status | Product series | L (µH) | ISAT,10% (A) | ISAT,30% (A) | RDC max. (mΩ) | fres (MHz) | IRP,40K (A) | Mount | Samples |
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