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Texas Instruments CC1310F128RGZR | Demoboard TIDA-00838
Heat Cost Allocator with wM-Bus at 868 MHz Reference Design
Overview
| Topology | Wireless Power Transfer |
| IC revision | 1.0 |
Description
The TIDA-00838 reference design implements a heat cost allocator system following the EN834 standard with the “two-sensor measurement method". The solution achieves better than 0.5 degrees Celsius accuracy across a range of +20 to +85°C. Two analog temperature sensors are available as matched pairs to eliminate the need for calibration during manufacturing and lowering OEM system cost. Wireless MCU offers wM-Bus support for S-, T- and C-modes (Meter device) at 868MHz and controls the two temperature sensors.
Features
Highly accurate temperature sensing across environment conditions: better than 0.5 degrees from +20 to +85°C.CC1310 SimpleLink(TM) Wireless MCU provides single-chip solution for heat measurement and RF communicationsSensor Controller interfaces seamlessly to two matched LMT70A, which eliminate the need for calibration during manufacturing and lower OEM system costExample source code for wM-Bus @868 MHz transmission for S, T and C-modes (“Meter” device) under TI RTOSCost-optimized 2-layer PCB in HCA form factor and a 96-segments 4-MUX LCDCap Touch button on the PCB for LCD on/off
Typical applications
- Internet of Things (IoT) or Wearable Applications With Precise Temperature Sensing and Sub-1GHz RF Link
- HCAs Compliant to EN834 With wM-Bus RF Protocol at 868 MHz and up to 15-dBm Transmit Output Power
- Water and Heat Meters With wM-Bus at 868 MHz Subsystem and Segment LCD Functionality
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | IR (mA) | IR 2 (mA) | ISAT (mA) | RDC (mΩ) | Type | L (µH) | Tol. L | Test Condition L | Qmin. (%) | Test Condition Q | RDC max. (mΩ) | IR (mA) | fres (MHz) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080GS75000 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Green | 515 | 450 | 3.2 | InGaN | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | 0.7 | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 74479777268 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WE-PMI Power Multilayer Inductor | – | – | – | – | – | – | – | – | – | – | 0805 | -40 °C up to +125 °C | 17 | – | – | – | 2 | 1.2 | 1.25 | – | – | 600 | 900 | 200 | 300 | Low RDC | 6.8 | ±20% | 1 MHz/ 5 mA | – | – | 375 | – | 40 | ||
 | 744765068A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.0068 | ±5% | 250 MHz | 20 | 250 MHz | 83 | 680 | 4800 | ||
| 744765075A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.0075 | ±5% | 250 MHz | 25 | 250 MHz | 104 | 680 | 5800 | ||
| 744765112A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.012 | ±5% | 250 MHz | 26 | 250 MHz | 120 | 640 | 3600 | ||
| 744765118A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.018 | ±5% | 250 MHz | 25 | 250 MHz | 230 | 420 | 3100 | ||
 | 885012005049 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 pF | ±0.5pF | 50 | 0402 | -55 °C up to +125 °C | 420 | – | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012005052 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 3.3 pF | ±0.5pF | 50 | 0402 | -55 °C up to +125 °C | 466 | – | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012005061 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205037 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012105012 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 1 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 15 | 0.05 GΩ | X5R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – |
| Samples |
|---|
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | IR (mA) | IR 2 (mA) | ISAT (mA) | RDC (mΩ) | Type | L (µH) | Tol. L | Test Condition L | Qmin. (%) | Test Condition Q | RDC max. (mΩ) | IR (mA) | fres (MHz) | Samples |
|---|