Topology | Other Topology |
IC revision | A |
The DS90UB953A-Q1 serializer is part of TI’s FPD-Link III device family designed to support high-speed raw data sensors including 2.3MP imagers at 60-fps and as well as 4MP, 30-fps cameras, satellite RADAR, LIDAR, and Time-of-Flight (ToF) sensors. The device is fully AEC-Q100 (Grade 1) qualified with a –40°C to 125°C wide temperature range. The higher temperature enables more compact/flexible sensor module design for any small camera application. The chip delivers a 4.16-Gbps forward channel and an ultra-low latency, 50-Mbps bidirectional control channel and supports power over a single coax (PoC) or STP cable. The DS90UB953A-Q1 features advanced data protection and diagnostic features to support ADAS and autonomous driving. Together with a companion deserializer, the DS90UB953A-Q1 delivers precise multi-camera sensor clock and sensor synchronization.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Samples | |
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150060VS75000 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Bright Green | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.7 | – | Tape and Reel | |||
885012005044 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 47 pF | ±5% | 25 | 0402 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel |
Order Code | Datasheet | Simulation | |
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150060VS75000 | SPEC | ||
885012005044 | SPEC |
Samples |
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Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Samples |
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