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Texas Instruments MSP432E401Y | Demoboard LEDMCUEVM-132
MSP432E401Y MCU communications board for LED evaluation modules
Overview
| Topology | Other Topology |
| Input voltage | 5 V |
Description
The LEDMCUEVM-132 implements SPI communications that support multiple devices on the bus, UART communications for the LMMs family of devices, CAN transceiver for UART to control LMM family of devices, 4 PWM signals for dimming, multiple IOs, isolated 5-V supply, digital isolators, and a standard CAN bus with a transceiver.
Features
SPI communications that supports up to 6 devices on the busUART communications to work with LMM productsCAN transceivers for both UART communications and CAN protocol communications4 dedicated PWM signals for PWM dimmingMultiple GPIOs to support specialized featuresDigital Isolators for all MSP432 signals for protectionIsolated 5-V supply
Typical applications
- Industrial Ethernet Gateway
- Wireless to Ethernet Gateway
- Industrial Smart Gateway
- Zone Controllers for Building Automation
- Factory Automation Data Collectors and Gateway
- Data Concentrators for Grid Infrastructure
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Product series | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 885012206086 | SPEC | 8 files | WCAP-CSGP MLCCs 50 V(DC) | 3.3 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | 2.5 | 10 GΩ | X7R Class II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | ||
| 885012106018 | SPEC | 8 files | WCAP-CSGP MLCCs 16 V(DC) | 2.2 µF | ±20% | 16 | 0603 | -55 °C up to +85 °C | 10 | 0.05 GΩ | X5R Class II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel |
| Order Code | Datasheet | Simulation | |
|---|---|---|---|
| 885012206086 | SPEC | |
| 885012106018 | SPEC |
| Samples |
|---|
| Order Code | Datasheet | Simulation | Downloads | Product series | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Samples |
|---|