Texas Instruments UCC5870-Q1 | Demoboard UCC5870QDWJEVM-026

Description

The UCC5870-Q1 evaluation kit can be used standalone to test the UCC5870-Q1 driver with 100-nFcapacitor dummy load soldered on the board, it can also be used to drive IGBT module directly for highpower test. The MCU daughter board is populated with 3-position headers for flexibility in configuringdifferent SPI communication methods. The EVM PCB layout is optimized with minimal loop area in theinput and output paths for the best performance of high power test

Features

.1 Features

• 15-A peak split sink/source drive current for fast turn ON and turn OFF time
• Driver output voltages by default are +15V/-8V with 12-V input supply
• 3750-VRMS one minute isolation per UL 1577 for UCC5870-Q1
• 3000-VRMS one minute isolation for the flyback transformer

• 8-mm creepage distance between primary and secondary

• Desat short-circuit protection and active Vce clamp
• Active miller clamp using internal or external FET
• Fault feedback and reset
• ADC for temperature sensing and DC bus voltage sensing
• Primary and secondary ASC
• SPI based device reconfiguration, verification, supervision and diagnosis
• Compatible with 820A 750V IGBT module FS820R08A6P2B

Typical applications

• HEV and EV traction inverter
• HEV and EV power modules

More information

• Datasheet