IC manufacturers Texas Instruments
IC manufacturers (99)
- All manufacturers
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (172)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (929)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (110)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Texas Instruments CC1310F128RGZR | Demoboard TIDA-00646
Matched Precision Temperature Sensing Reference Design for Heat Cost Allocators
Overview
| Topology | Wireless Power Transfer |
| IC revision | 1.0 |
Description
The TIDA-00646 reference design demonstrates techniques for precision temperature sensing as required by heat cost llocators and other Internet of Things (IoT) applications. Heat cost allocators use the temperature differential between Room and Heater body to assign a share of the total cost of a central heating system among multiple users. TIDA-00646 achieves better than 0.5 degrees Celsius accuracy across a range of +20 to +85°C. The LMT70A CMOS sensors used in the design are available as matched pairs to eliminate the need for calibration during manufacturing, lowering OEM system cost. The design is compliant to the EN834 standard using the “two-sensor measurement method”.
Features
Remark: BOM and Schematics are added with main pdf.
Highly accurate temperature sensing across environment conditions: better than 0.5 degrees from +20 to +85degCMatching of two adjacent LMT70A sensors on Tape and Reel saves test and manufacturing costCC1310 SimpleLink(TM) wireless MCU provides single-chip solution for heat measurement and RF communicationsLow power operation down to 2.0V extends battery lifetimeCost-optimized two-layer PCB layout in HCA form factor
Typical applications
- Heat Cost Allocators With w-MBus RF Protocol at 868 MHz up to 15-dBm Transmit Output Power (Compliant to EN834)
- Internet of Things and Wearable Applications With Precise Temperature Sensing
- Heat Cost Allocators With w-MBus RF Protocol at 868 MHz up to 15-dBm Transmit Output Power
- Precision Temperature Sensing With Matched CMOS Sensors in Any Wireless Application
- Precision Temperature Sensing With Matched CMOS Sensors in Any Wireless Application
- Internet of Things and Wearable Applications With Precise Temperature Sensing
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | IR (mA) | IR 2 (mA) | ISAT (mA) | RDC (mΩ) | Type | L (µH) | Tol. L | Test Condition L | Qmin. (%) | Test Condition Q | RDC max. (mΩ) | IR (mA) | fres (MHz) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080GS75000 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Green | 515 | 450 | 3.2 | InGaN | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | 0.7 | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 74479777268 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WE-PMI Power Multilayer Inductor | – | – | – | – | – | – | – | – | – | – | 0805 | -40 °C up to +125 °C | 17 | – | – | – | 2 | 1.2 | 1.25 | – | – | 600 | 900 | 200 | 300 | Low RDC | 6.8 | ±20% | 1 MHz/ 5 mA | – | – | 375 | – | 40 | ||
 | 744765068A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.0068 | ±5% | 250 MHz | 20 | 250 MHz | 83 | 680 | 4800 | ||
| 744765075A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.0075 | ±5% | 250 MHz | 25 | 250 MHz | 104 | 680 | 5800 | ||
| 744765112A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.012 | ±5% | 250 MHz | 26 | 250 MHz | 120 | 640 | 3600 | ||
| 744765118A | SPEC | 10 files | Active i| Production is active. Expected lifetime: >10 years. | WE-KI SMT Wire Wound Ceramic Inductor | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | 0.5 | – | – | – | – | – | – | – | 0.018 | ±5% | 250 MHz | 25 | 250 MHz | 230 | 420 | 3100 | ||
 | 885012005049 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 pF | ±0.5pF | 50 | 0402 | -55 °C up to +125 °C | 420 | – | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012005052 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 3.3 pF | ±0.5pF | 50 | 0402 | -55 °C up to +125 °C | 466 | – | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012005061 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Class I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205037 | SPEC | 6 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012105012 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 1 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 15 | 0.05 GΩ | X5R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – |
| Samples |
|---|
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | Q | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | IR (mA) | IR 2 (mA) | ISAT (mA) | RDC (mΩ) | Type | L (µH) | Tol. L | Test Condition L | Qmin. (%) | Test Condition Q | RDC max. (mΩ) | IR (mA) | fres (MHz) | Samples |
|---|