IC manufacturers Texas Instruments

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Texas Instruments CC1310F128RGZR | Demoboard TIDA-00646

Matched Precision Temperature Sensing Reference Design for Heat Cost Allocators

Overview

TopologyWireless Power Transfer
IC revision1.0

Description

The TIDA-00646 reference design demonstrates techniques for precision temperature sensing as required by heat cost llocators and other Internet of Things (IoT) applications. Heat cost allocators use the temperature differential between Room and Heater body to assign a share of the total cost of a central heating system among multiple users. TIDA-00646 achieves better than 0.5 degrees Celsius accuracy across a range of +20 to +85°C. The LMT70A CMOS sensors used in the design are available as matched pairs to eliminate the need for calibration during manufacturing, lowering OEM system cost. The design is compliant to the EN834 standard using the “two-sensor measurement method”.

Features

Remark: BOM and Schematics are added with main pdf.

Highly accurate temperature sensing across environment conditions: better than 0.5 degrees from +20 to +85degCMatching of two adjacent LMT70A sensors on Tape and Reel saves test and manufacturing costCC1310 SimpleLink(TM) wireless MCU provides single-chip solution for heat measurement and RF communicationsLow power operation down to 2.0V extends battery lifetimeCost-optimized two-layer PCB layout in HCA form factor

Typical applications

  • Heat Cost Allocators With w-MBus RF Protocol at 868 MHz up to 15-dBm Transmit Output Power (Compliant to EN834)
  • Internet of Things and Wearable Applications With Precise Temperature Sensing
  • Heat Cost Allocators With w-MBus RF Protocol at 868 MHz up to 15-dBm Transmit Output Power
  • Precision Temperature Sensing With Matched CMOS Sensors in Any Wireless Application
  • Precision Temperature Sensing With Matched CMOS Sensors in Any Wireless Application
  • Internet of Things and Wearable Applications With Precise Temperature Sensing

Products

Order Code Data­sheet Simu­lation Downloads Status Product seriesλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
CTol. CVR
(V (DC))
SizeOperating TemperatureQDF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
PackagingIR
(mA)
IR 2
(mA)
ISAT
(mA)
RDC
(mΩ)
TypeL
(µH)
Tol. LTest Condition LQmin.
(%)
Test Condition QRDC max.
(mΩ)
IR
(mA)
fres
(MHz)
Samples
150080GS75000SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WL-SMCW SMT Mono-color Chip LED Waterclear 525 Green 515 450 3.2 InGaN 140 0805 -40 °C up to +85 °C 2 1.25 0.7 Tape and Reel
74479777268SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WE-PMI Power Multilayer Inductor 0805 -40 °C up to +125 °C 17 2 1.2 1.25 600 900 200 300 Low RDC 6.8 ±20% 1 MHz/ 5 mA 375 40
744765068ASPEC
10 files Active i| Production is active. Expected lifetime: >10 years.WE-KI SMT Wire Wound Ceramic Inductor 0402A -40 °C up to +125 °C 1 0.55 0.5 0.0068 ±5% 250 MHz 20 250 MHz 83 680 4800
744765075ASPEC
10 files Active i| Production is active. Expected lifetime: >10 years.WE-KI SMT Wire Wound Ceramic Inductor 0402A -40 °C up to +125 °C 1 0.55 0.5 0.0075 ±5% 250 MHz 25 250 MHz 104 680 5800
744765112ASPEC
10 files Active i| Production is active. Expected lifetime: >10 years.WE-KI SMT Wire Wound Ceramic Inductor 0402A -40 °C up to +125 °C 1 0.55 0.5 0.012 ±5% 250 MHz 26 250 MHz 120 640 3600
744765118ASPEC
10 files Active i| Production is active. Expected lifetime: >10 years.WE-KI SMT Wire Wound Ceramic Inductor 0402A -40 °C up to +125 °C 1 0.55 0.5 0.018 ±5% 250 MHz 25 250 MHz 230 420 3100
885012005049SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 50 V(DC)1 pF ±0.5pF 50 0402 -55 °C up to +125 °C 42010 GΩ NP0 Class I 1 0.5 0.5 0.25 7" Tape & Reel
885012005052SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 50 V(DC)3.3 pF ±0.5pF 50 0402 -55 °C up to +125 °C 46610 GΩ NP0 Class I 1 0.5 0.5 0.25 7" Tape & Reel
885012005061SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 50 V(DC)100 pF ±5% 50 0402 -55 °C up to +125 °C 100010 GΩ NP0 Class I 1 0.5 0.5 0.25 7" Tape & Reel
885012205037SPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 16 0402 -55 °C up to +125 °C 55 GΩ X7R Class II 1 0.5 0.5 0.25 7" Tape & Reel
885012105012SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSGP MLCCs 10 V(DC)1 µF ±20% 10 0402 -55 °C up to +85 °C 150.05 GΩ X5R Class II 1 0.5 0.5 0.25 7" Tape & Reel
Samples
Order Code Data­sheet Simu­lation Downloads Status Product seriesλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
CTol. CVR
(V (DC))
SizeOperating TemperatureQDF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
PackagingIR
(mA)
IR 2
(mA)
ISAT
(mA)
RDC
(mΩ)
TypeL
(µH)
Tol. LTest Condition LQmin.
(%)
Test Condition QRDC max.
(mΩ)
IR
(mA)
fres
(MHz)
Samples