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Onsemi NCP1096 | Demoboard NCP1096GEVB PoE
NCP1096: Power Over Ethernet – Powered Device Interface Controller with integrated hot swap FET, IEEE 802.3bt
Overview
| Topology | Buck Converter |
| Input voltage | 34-57 V |
| IC revision | 1 |
Description
Part of ON Semiconductor’s family of IEEE.3bt, IEEE 802.3af, and/or IEEE 802.3at compliant solutions Power over Ethernet Powered Devices (PoE-PD), the NCP1096 supports the development of high power applications including connected lighting and USB Type C. The NCP1096 incorporates all necessary functions within a PoE system such as detection, classification and current limiting during the inrush phase.Using an internal hot-swap FET, the NCP1096 provides an output voltage of up to 90 Watts. For improved energy efficiency, the NCP1096 offers Autoclass support which optimizes power allocation based on the PD type and classification.
Features
- IEEE 802.3bt, IEEE 802.3af, IEEE 802.3at compliant - Allows for up to 90 W of power - Guaranteed interoperability between PoE devices
- Part of ON Semiconductor’s family of low-power solutions for PoE-PD
- 5-Event Physical Layer Classification
- Smart power budgeting using Autoclass support which allows the PSE to assign power to each PD efficiently
- Active bridge and hot-swap FET disable when auxililary supply connected, increases power efficiency where auxiliary supply powers a PD
- Also available with external hot-swap FET for operation >71 W (NCP1095)
Typical applications
- Power over Ethernet Powered Devices (PoE-PD), Internet of Things (IoT), IEEE 802.3bt, IEEE 802.3af, IEEE 802.3at
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | Pins (Value) (pcs) | Application | PCB/Cable/Panel | Modularity | Type | Wire Section | xPxC | Tab | EMI | Application System | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Data rate | Ports | PoE | Improved CMRR | Operating Temperature | VT (V (RMS)) | Mount | L (µH) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691412120003B | SPEC | – | 6 files | Active i| Production is active. Expected lifetime: >10 years. | WR-TBL Series 412B - 3.50 mm Screwless 45° Entry - 2.1 mm 2 Wires | 3 | Screwless | PCB | No | 45° | 14 to 20 (AWG) 2.08 to 0.518 (mm²) | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | 12 | – | – | – | Box | – | – | – | – | -40 °C up to +105 °C | – | THT | – | |
 | 7490220123 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WE-LAN LAN Transformer | 24 | – | – | – | 4PPoE (to 1400 mA) | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | – | – | 18.04 | 14.7 | 9.05 | 13.97 | – | 1000 Base-T | 1 | 4PPoE (up to 1500 mA) | No | -40 °C up to +105 °C | 1500 | SMT | 180 | ||
 | 61500814221 | SPEC | – | 6 files | Active i| Production is active. Expected lifetime: >10 years. | WR-MJ Modular Jack Horizontal Shielded 8P8C Tab Down | – | – | – | – | Horizontal | – | 8P8C | Down | No | CAT 3 | – | – | – | – | – | – | 500 MΩ | – | – | – | – | – | Tray | – | 1x1 | – | – | -40 °C up to +85 °C | – | THT | – | |
 | 885342210004 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSMH Mid and High Voltage | – | – | – | – | – | – | – | – | – | – | 1 nF | ±10% | 3000 | 1808 | -55 °C up to +125 °C | 2.5 | 10 GΩ | X7R Class II | 4.5 | 2.03 | 2 | 0.5 | 7" Tape & Reel | – | – | – | – | -55 °C up to +125 °C | – | – | – |
| Order Code | Datasheet | Simulation | |
|---|---|---|---|
| 691412120003B | SPEC | – |
| 7490220123 | SPEC | |
| 61500814221 | SPEC | – |
| 885342210004 | SPEC |
| Samples |
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| Order Code | Datasheet | Simulation | Downloads | Status | Product series | Pins (Value) (pcs) | Application | PCB/Cable/Panel | Modularity | Type | Wire Section | xPxC | Tab | EMI | Application System | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Data rate | Ports | PoE | Improved CMRR | Operating Temperature | VT (V (RMS)) | Mount | L (µH) | Samples |
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